Steag RTP Systems Back Radiant Silicon Ring for High Temperature Processes – 200 mm
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Steag RTP Systems Back Radiant Silicon Ring for High Temperature Processes – 200 mm
- Manufacturer: Steag RTP Systems
- Description: Back Radiant Silicon Ring for High Temperature Processes
- Application: 200 mm wafers (Notch Type)
- RESS Number: 44000012
- Vendor: Mattson Technology, Inc.
- Inventory P/N: SE-020615-N1
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Old P/N: 2MSMAT-1588
The Steag RTP Systems Back Radiant Silicon Ring is a precision high-purity silicon process component designed for rapid thermal processing (RTP) equipment handling 200 mm wafers. Installed beneath and around the wafer during processing, the radiant ring enhances thermal uniformity, minimizes edge temperature gradients, and supports repeatable high-temperature semiconductor manufacturing processes. Designed for rapid thermal annealing (RTA), oxidation (RTO), nitridation (RTN), and other thermal applications, the ring is manufactured to semiconductor-grade cleanliness standards and supplied in cleanroom packaging. The component is intended for use with compatible Steag RTP systems and should be cleaned and flash etched prior to installation as recommended by the manufacturer.